As photonic integrated circuits (PICs) continue to evolve, traditional inspection tools can’t keep up with the complex geometries and high-mix, low-volume production environments. To bridge this gap, we co-developed Helios: a visual inspection tool tailored for photonic wafers.
Nobleo contributed core technologies, including high-speed camera control and AI-based defect detection, powered by our in-house NoblAI framework. This flexible platform helps manage datasets, streamline annotation and accelerate the deployment of tailored vision algorithms. In this project, NoblAI plays a central role in enabling efficient and accurate inspection across both early-stage development and industrial-scale production.
Helios inspects up to 10 wafers per hour at sub-micron resolution, enabling detection of defects as small as 100 nm and seamless overlay with GDSII design files.
📊 Defect maps are directly linked to design files (GDSII)
🌐 Experts collaborate remotely via web-based annotation
📈 The system supports a smooth transition from offline to inline inspection
This solution is the result of a strong collaboration with IMS, Workfloor, Settels Savenije and LioniX International, under the MEKOPP and NXTGEN Hightech programmes.
Read here the full article in Mikroniek 2025-2 – AI PIC defect detection
Many thanks to DSPE and Mikroniek for the publication.