PITC Metrology Program and Nobleo Technology join forces to advance photonic wafer inspection

PITC Metrology Program and Nobleo Technology B.V. have signed a Memorandum of Understanding to accelerate innovation in photonic wafer inspection and process monitoring.

Together we combine Nobleo’s expertise in image analysis and machine learning with PITC’s strong research and development ecosystem. The goal: next-generation metrology tools that boost process efficiency and yield in PIC manufacturing.

Sylwester Latkowski, Scientific Director of PITC – Photonic Integration Technology Center, welcomes the collaboration: “Nobleo brings relevant, contemporary methods to photonic chip metrology, and we are pleased to support their further development.”
From Nobleo’s side, Rik Wetzels highlights the value of this partnership: “PITC provides an excellent environment for testing and refining our systems.”

This collaboration marks an important step towards next-generation metrology tools that improve process efficiency and yield in photonic manufacturing.